TECHNICAL COMMENT

This is about new techniques which we are working on at present, technical comments on future products, evaluation, and current R and D. We are trying out utmost not only to use top quality materials but to optimize circuit design and placement of parts in all our products.

@This design is for the PC2-4300,5300,6400/DDR2-533,667,800
@4-layer PCB vs. 6-layer PCB
@DDR400 high-end memory module
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